The process yielded more than 96% defluorination efficiency and 99.98% removal of perfluorooctanoic acid (PFOA), a common ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next ...

A new technical paper titled “Scaling On-Device GPU Inference for Large Generative Models” was published by researchers at ...

Robust testing is required to ensure that compiler optimizations or microarchitectural effects don’t introduce ...

Time ESD Monitoring and Control in Semiconductor Manufacturing Environments With Silicon Chip of ESD Event Detection” was ...

A new technical paper titled “Investigating Self-Heating Effects in Ferroelectric FinFETs for Reliable In-Memory Computing” ...

Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia ...

Triggered Hardware Trojan Attack on Spiking Neural Networks” was published by researchers at Sorbonne Universite, CNRS and ...

In AI data centers, there are two main types of interconnects: Scale-Out: Optical links connect switches across racks and ...

Opening the door to third-party chiplet makers requires new approaches, greater diligence, and a deeper focus on security.

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor industry for years to come.

Sensor and Data Collection ADAS/AD relies heavily on perception sensors like cameras, radars, LiDARs, ultrasonics, and, more ...