Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chip smuggling; AI export controls; Middle East AI deals; DeepSeek's new report; OSAT revenue up; AI PC memory chipsets; big ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...

High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.

A new technical paper titled “Hardware vs. Software Implementation of Warp-Level Features in Vortex RISC-V GPU” was published ...

Benchmarking 3D-IC cooling; rad-hard flip-flops; high-speed data error correction. Researchers from Massachusetts Institute ...

A new technical paper titled “Key Safety Design Overview in AI-driven Autonomous Vehicles” was published by researchers at ...

A new technical paper titled “Memory Prefetching Evaluation of Scientific Applications on A Modern HPC Arm-based Processor” ...

Just adding more or thicker wires to a design isn't sufficient with chiplets.

An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.