GaN (Gallium Nitride) technology innovator Finwave Semiconductor has announced a successful $8.2m bridge investment round.

Imec and TNO have officially launched the Holst Centre Photonics Lab, a state-of-the-art facility dedicated to integrated ...

Rambus has made available complete client chipsets for next-generation AI PC memory modules with two new PMICs.

Samsung, much like Intel, has been looking to close the gap with TSMC by landing major external orders for its 2nm node.

Cadence's Tensilica NeuroEdge 130 AI Co-Processor (AICP) is a new class of processor designed to complement NPUs.

To overcome development challenges, wireless IoT developers need high-quality educational resources.

OMRON Electronic Components Europe has introduced the G9EJH-1-E, an ultra-compact DC power relay, delivering inrush ...

POLYN, a developer of Neuromorphic Analogue Signal Processing (NASP) technology, tapes out its first NASP chip.

ST inertial measurement unit combines sensors for activity tracking and high-g impact measurement in a single package.

Hirose has developed an automotive wire-to-board connector that meets the GMW3191 standard for automotive applications.

The NRU-156U3-FT AI controller from Acceed provides a new fanless chassis design for installation in confined spaces.

Aimed at installed applications such as wall sockets, desks, and furniture, these ultra-compact and fully assembled modules ...